On Semi NVG800A75L4DSC 750V 800A汽车应用方案

On Semi公司的NVG800A75L4DSC/D是用于汽车的750V 800A双面冷却的半桥功率模块,具有紧凑的占位面积.模块包括半桥配置的两个场截止式4(FS4) 750V窄台衬底IGBT.芯片组采用新的窄台衬底IGBT技术,以提高大电流密度和强健的短路保护能力和更高的阻断电压,为电动汽车(EV) 牵引动力提供杰出的性能.器件集成了芯片级温度和电流传感器,连续工作温度Tvj max = 175C.具有超低的寄生电感和低VCESAT和开关损耗,采用汽车级FS4和快速二极管芯片技术,DBC衬底隔离4.2kV,具有AEC资质和生产件批准程序(PPAP).主要用在混合和电动汽车牵引动力逆变器和大功率DC/DC转换器.本文介绍了NVG800A75L4DSC/D主要特性,电路图,以及评估板NVG800A75L4DSC−EVK主要特性,简化框图,主要元件图和片上电流检测电路图.

The NVG800A75L4DSC is part of a family of power modules withdual side cooling and compact footprints for Hybrid (HEV) andElectric Vehicle (EV) traction inverter application.

The module consists of two Field Stop 4 (FS4) 750V Narrow MesaIGBTs in a half−bridge configuration. The chipset utilizes the newnarrow mesa IGBT technology in providing high current density androbust short circuit protection with higher blocking voltage to deliveroutstanding performance in EV traction applications.

A dual side liquid cooling heatsink reference design along with acomplete inverter kit (NVG800A75L4DSC−EVK) is available toenable easier design in.

NVG800A75L4DSC主要特性:

• Dual−Side Cooling

• Integrated Chip Level Temperature and Current Sensor

• Tvj max = 175C for Continuous Operation

• Ultra−low stray inductance

• Low VCESAT and Switching Losses

• Automotive Grade FS4 & Fast Diode Chip Technologies

• 4.2 kV Isolated DBC Substrate

• AEC Qualified and PPAP Capable

• This Device is Pb−Free and is RoHS Compliant

NVG800A75L4DSC典型应用:

• Hybrid and Electric Vehicle Traction Inverter

• High Power DC−DC Converter