Microsemi低功耗SmartFusion2 SoC FPGA开发方案

Microsemi公司的SmartFusion2 SoC FPGA是低功耗FPGA器件,集成了第四代基于闪存FPGA架构,166MHz ARM Cortex-M3处理器和高性能通信接口,是业界最低功耗,最可靠和最高安全的可编逻辑解决方案.高速串行接口包括PCIe,10Gbps附加单元接口(XAUI)/XGMII)以及SerDes通信,主要用在数据安全,马达控制,系统管理,工业自动化,高速串行I/O应用,PCIe,,SGMII以及用户定义的串行接口.本文介绍了SmartFusion2 SoC FPGA主要特性,框图和芯片布局图,以及SmartFusion2 SoC FPGA评估板M2S090TS-EVAL-KIT主要特性,框图,电路图,材料清单和PCB设计图.
Microsemi SmartFusion®2 SoC FPGAs integrate a fourth-generation, flash-based FPGA fabric, an ARMCortex-M3 processor, and high-performance communications interfaces on a single chip. TheSmartFusion2 family is the industry’s lowest-power, most reliable, and highest-security programmablelogic solution.
SmartFusion2 SoC FPGAs offer up to 3.6X the gate density and up to 2X the performance of previousflash-based FPGA families, and also include multiple memory blocks and multiply-accumulate blocks forDSP processing. The 166-MHz ARM Cortex-M3 processor is enhanced with an embedded tracemacrocell (ETM), a memory protection unit (MPU), an 8-KB instruction cache, and additional peripherals,including controller area network (CAN), gigabit Ethernet, and a high-speed universal serial bus (USB).
High-speed serial interfaces include PCI Express (PCIe), 10-Gbps Attachment Unit Interface(XAUI)/XGMII extended sublayer (XGXS), plus native serialization/deserialization (SerDes)communication. The DDR2/DDR3 memory controllers available in the devices provide high-speedmemory interfaces.
SmartFusion2 SoC FPGA主要特性:
The following sections list the features of SmartFusion2 SoC FPGAs.
Reliability
• Single event upset (SEU)-immune
• Zero FIT FPGA configuration cells
• Junction temperature
• 125 °C—military temperature
• 100 °C—industrial temperature
• 85 °C—commercial temperature
• 125 °C—automotive
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