MIcrosemi SmartFusion2 SoC双轴马达控制方案

MIcrosemi公司的SmartFusion2 SoC FPGA集成了第四代基于闪存的FPGA架构,一个ARM Cortex-M3处理器和高性能通信接口,具有业界最低功耗,最可靠和最安全的可编逻辑解决方案,主要应用在工业,国防,航空,通讯和医疗领域.本文介绍了SmartFusion2 SoC主要特性包括可靠性,安全性, 低功耗, 高性能FPGA, 微控制器子系统, 时钟源, 高速串口, 高速存储器接口和工作电压和I/O等,框图和芯片布局图以及SmartFusion2双轴马达控制板主要特性,框图,电路图,材料清单和PCB设计图.
Microsemi SmartFusion®2 SoC FPGAs integrate the fourth generation flash-based FPGA fabric, an ARM Cortex-M3 processor, and high-performance communications interfaces on a single chip. The SmartFusion2 family is the industry’s lowest power, most reliable, and highest security programmable logic solution. SmartFusion2 FPGAs offer up to 3.6X the gate density, up to 2X the performance of previous flash-based FPGA families, and also include multiple memory blocks and multiply accumulate blocks for DSP processing. The 166 MHz ARM Cortex-M3 processor is enhanced with an embedded trace macrocell (ETM), memory protection unit (MPU), 8 Kbyte instruction cache, and additional peripherals, including controller area network (CAN), Gigabit Ethernet, and high-speed universal serial bus (USB). High-speed serial interfaces include PCI Express (PCIe), 10 Gbps attachment unit interface (XAUI) / XGMII extended sublayer (XGXS) plus native serialization/deserialization (SerDes) communication, while DDR2/DDR3 memory controllers provide high-speed memory interfaces.
SmartFusion2 SoC主要特性:
可靠性:
• Single event upset (SEU) immune
• Zero FIT FPGA configuration cells
• Junction temperature
• 125 °C—military temperature
• 100 °C—industrial temperature
• 85 °C—commercial temperature
• 125 °C—automotive
• Single error correct double error detect (SECDED) protection on the following:
• Ethernet b...