Microsemi SmartFusion2 SoC FPGA系列高级开发方案

Microsemi公司的SmartFusion2 SoC FPGA系列集了第四代基于闪存的FPGA架构,ARM Cortex-M3处理器和高性能通信接口,是业界最低功耗最可靠和最安全的确可编逻辑解决方案.和以前的基于闪存的FPGA系列相比,提供3.6X门密度和2X性能;并包括多个存储器区块和用于DSP处理的乘法累加区块.主要用在马达,工业自动化和高速I/O应用等.本文介绍了SmartFusion2 SoC FPGA系列产品主要特性,框图,系列产品表和SmartFusion2 高级开发板M2S150-ADV-DEV-KIT主要特性,主要元件表,框图,电路图,PCB元件布局图和材料清单.
Microsemi SmartFusion®2 SoC FPGAs integrate fourth generation flash-based FPGA fabric, an ARM Cortex-M3 processor, andhigh-performance communications interfaces on a single chip. The SmartFusion2 family is the industry’s lowest power, most reliableand highest security programmable logic solution. SmartFusion2 FPGAs offer up to 3.6X the gate density, up to 2X the performanceof previous flash-based FPGA families, and includes multiple memory blocks and multiply accumulate blocks for DSP processing.
The 166 MHz ARM Cortex-M3 processor is enhanced with an embedded trace macrocell (ETM), memory protection unit (MPU),8 Kbyte instruction cache, and additional peripherals, including controller area network (CAN), Gigabit Ethernet, and high speed universal serial bus (USB). High speed serial interfaces include PCI EXPRESS (PCIe), 10 Gbps attachment unit interface (XAUI) /XGMII extended sublayer (XGXS) plus native serialization/deserialization (SERDES) communication, while DDR2/DDR3 memory
controllers provide high speed memory interfaces.
SmartFusion2 SoC FPGA主要特性:

Reliability
• Single Event Upset (SEU) Immune
– Zero FIT FPGA Configuration Cells
• Junction Temperature: 125℃ – Military Temperature,100℃ – Industrial Temperature, 85℃ – CommercialTemperature, 125℃ - Automotive
• Single Error Correct Double Error Detect (SECDED)Protection on the Following:
– Ethernet Buffers
– CAN Message Buffers
– Cortex-M3 Embedded Scratch Pad Memory...