Microsemi SmartFusion cSoC双马达控制解决方案

Microsemi 公司的SmartFusion双马达控制套件包括SmartFusion 评估板和与之配对的TRINAMIC公司的TMCM-AC-840子板,能为步进马达和无刷DC马达(BLDC)提供定制化片上系统(cSoC)马达控制平台,而SmartFusion cSoC器件集成了FPGA,ARM® Cortex™-M3处理器,以及可编程的模拟,提供完全定制的IP保护和容易使用;此外还集成了SRAM存储器和SPI闪存.本文介绍了SmartFusion cSoC主要特性,方框图和系统架构图,BLDC和步进马达演示设计基本框图以及SmartFusion双马达控制套件主要特性,SmartFusion 评估板主要特性,以及TMCM-AC-840子板主要特性,电路图和马达控制子板PCB布局图.
The SmartFusion® family of cSoCs builds on the technology first introduced with the Fusion mixed signal FPGAs. SmartFusion cSoCs are made possible by integrating FPGA technology with programmable high-performance analog and hardened ARM Cortex-M3 microcontroller blocks on a flash semiconductor process. The SmartFusion cSoC takes its name from the fact that these three discrete technologies are integrated on a single chip, enabling the lowest cost of ownership and smallest footprint solution to you.
SmartFusion定制片上系统(cSoC)主要特性:
Microcontroller Subsystem (MSS)
• Hard 100 MHz 32-Bit ARM® Cortex™-M3
– 1.25 DMIPS/MHz Throughput from Zero Wait State
Memory
– Memory Protection Unit (MPU)
– Single Cycle Multiplication, Hardware Divide
– JTAG Debug (4 wires), Serial Wire Debug (SWD, 2 wires), and Single Wire Viewer (SWV) Interfaces
• Internal Memory
– Embedded Nonvolatile Flash Memory (eNVM), 128 Kbytes to 512 Kbytes
– Embedded High-Speed SRAM (eSRAM), 16 Kbytes to 64 Kbytes, Implemented in 2 Physical Blocks to Enable Simultaneous Access from 2 Different
Masters
• Multi-Layer AHB Communications Matrix
– Provides up to 16 Gbps of On-Chip Memory Bandwidth,1 Allowing Multi-Master Schemes
• 10/100 Ethernet MAC with RMII Interface2
• Programmable External Memory Controller, Which
Supports:
– Asynchronous Memories
– NOR Flash, SRAM, PSRAM
...