鍦ㄧ嚎搴ц皥

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鍏充簬鏈搴ц皥

搴ц皥绠浠

鎭╂櫤娴﹀崐瀵间綋鎻愪緵瀹屾暣鑲栫壒鍩轰簩绾х浜у搧搴旂敤浜嶤harger璁惧浜屾渚ф暣娴佷簩鏋佺鐨勫簲鐢ㄦ柟妗堬紝浠ユ敮鎸佸鎴疯兘寰楀埌鏇村ソ鐨勬晥鐜囷紝闄嶄綆楂樺害闄愬埗锛屽噺灏戠數璺澘灏哄銆

鏈鐮旇浼氬皢浠庝互涓嬪嚑鏂归潰杩涜浠嬬粛锛
1.  鍒涙柊灏佽鎶鏈
2.  鏂 45V/50V 鐢垫簮鑲栫壒鍩轰簩绾х
3.  鑴氫綅甯冨眬涓庡彲鎮嶆

涓撳浠嬬粛

璁告棴鏅 璁告棴鏅
璧勬繁宸ョ▼甯 		鐜颁换鎭╂櫤娴﹀崐瀵间綋閫氱敤鍣ㄤ欢璧勬繁宸ョ▼甯堬紝鍏锋湁13骞寸殑DC/DC鐢垫簮鍙婄鏁ｅ櫒浠剁幇鍦烘敮鎸佸伐绋嬪笀缁忓巻

绮惧僵闂瓟

[ 鏈杩 10 鏉￠棶绛 ] [ 鍏ㄩ儴鍙戣█ ]
[闂細lpgoal] CFP15鑳界敤鍦ㄥ揩閫熷厖鐢典腑涔 
[绛旓細martinhsu] It is dependence on the fast charger spec requirement  [2014-7-17 10:19:12]
[涓绘寔浜猴細ChinaECNet] 鍚勪綅缃戝弸澶у涓婂崍濂斤紝娆㈣繋鍙傚姞涓數缃戝湪绾垮骇璋堬紝浠婂ぉ鎴戜滑閭璇峰埌NXP鐨勪笓瀹讹紝涓庡ぇ瀹跺叡鍚屾帰璁ㄢ淐FP15 灏佽鑲栫壒鍩轰簩绱氱鍦ㄥ井鍨嬪寲charger璁捐鈥濓紝娆㈣繋澶у韪婅穬鎻愰棶锛  [2014-7-17 10:19:24]
[涓绘寔浜猴細ChinaECNet] 鍚勪綅缃戝弸锛岀幇鍦ㄦ垜浠凡缁忚繘鍏ラ棶绛旂幆鑺傦紝濡傛灉鎮ㄦ兂閲嶅瑙傜湅鍒氭墠鎾斁鐨勬紨璁插唴瀹癸紝璇风偣鍑婚〉闈笂鏂圭殑鈥滃湪绾挎紨绀衡濄  [2014-7-17 10:19:48]
[闂細zhangjshl] 璇烽棶锛氬伐浣滄俯搴︽槸澶氬皯锛 
[绛旓細martinhsu] Tj(max) is 150deC.  [2014-7-17 10:24:10]
[涓绘寔浜猴細ChinaECNet] 鍚勪綅缃戝弸锛屼粖澶╁弬鍔犻棶绛旂殑涓撳浜烘暟杈冨皯锛屽洖绛旈棶棰樼殑閫熷害浼氭瘮杈冩參涓鐐癸紝璇峰ぇ瀹惰愬績绛夊緟锛岃阿璋紒  [2014-7-17 10:24:24]
[闂細zhangjshl] 鍙嶅悜鎭㈠鏃堕棿鏄灏戯紵 
[绛旓細martinhsu] It is 16nS typical  [2014-7-17 10:26:05]
[闂細stu_deepblue] 鏈澶х數娴佹湁澶氬ぇ鐨 
[绛旓細martinhsu] Currently our product support 10A and 15A.  [2014-7-17 10:26:52]
[闂細hjb85] 鍙嶅悜鎭㈠鏃堕棿闇瑕佸涔咃紵 
[绛旓細martinhsu] It is 16nS typical.  [2014-7-17 10:27:36]
[闂細liang-1011] 鏈澶ф敮鎸佸澶ф寔缁數娴侊紵 
[绛旓細martinhsu] We have two type support 10A and 15A.  [2014-7-17 10:28:08]
[闂細joiny] CFP15灏佽鐨勪紭鍔挎湁鍝簺锛 
[绛旓細martinhsu] higher thermal performance and smaller dimension  [2014-7-17 10:28:51]
[涓绘寔浜猴細ChinaECNet] 鍚勪綅缃戝弸锛岀幇鍦ㄦ垜浠凡缁忚繘鍏ラ棶绛旂幆鑺傦紝濡傛灉鎮ㄦ兂閲嶅瑙傜湅鍒氭墠鎾斁鐨勬紨璁插唴瀹癸紝璇风偣鍑婚〉闈笂鏂圭殑鈥滃湪绾挎紨绀衡濄  [2014-7-17 10:29:53]
[闂細jwdxu2009] 鎬т环姣斿浣曪紝 
[绛旓細martinhsu] cost effective with high performance  [2014-7-17 10:30:04]
[闂細hjb85] 鍐呴儴閲囩敤浠涔堟潗鏂欙紵 
[绛旓細martinhsu] It is used the clip bonding technolog to instead of the normal wire bonding.  [2014-7-17 10:31:02]
[闂細hc0814] 鏈夊嚑绉嶅皝瑁 
[绛旓細martinhsu] The CFP15 package is optimize for Low Power Adapter 10W ~15W application.  [2014-7-17 10:35:31]
[闂細jackson2005] 浣跨敤CFP15灏佽鑲栫壒鍩哄湪PCB甯冭仈鏈洪渶娉ㄦ剰浠涔?浠ヤ究鍙互鍙戞尌鍏跺簳閮ㄦ暎鐑墖鍔熻兘? 
[绛旓細martinhsu] As big as possible for the thermal pad size to increase the let the heat dissipate through the PCB well.  [2014-7-17 10:37:12]
[闂細zh_angei] 鍝湁璇︾粏璧勬枡涓嬭浇鏈浣庡伐浣滄俯搴︽槸澶氬皯璋㈣阿 
[绛旓細martinhsu] The minimum temperature is -65deC.  [2014-7-17 10:38:31]
[闂細jackson2005] 浣跨敤CFP15灏佽鑲栫壒鍩哄彲浠ュ鍔犲灏戞晥鐜?鏈夋棤瀹炴祴鏁版嵁鏀寔? 
[绛旓細martinhsu] The CFP15 is high C/P value solution for cost and performance point of view.  [2014-7-17 10:41:03]
[闂細鏈ㄥ瓙楸糫 宸ヤ綔鏈澶ч鐜囨槸澶氬皯锛 
[绛旓細martinhsu] It is really dependence on application.  [2014-7-17 10:44:02]
[闂細cquwuqiang] 涓嶅鍔犲姞鏁ｇ儹鍣紝鎱㈣礋鑽峰伐浣滃櫒浠舵俯鍗囨槸澶氬皯锛 
[绛旓細martinhsu] It is dependence on the PCB PAD size.  [2014-7-17 10:45:37]
[闂細jackson2005] 鏈夋棤瀹為檯搴旂敤渚?浣跨敤NXP鐨勪骇鍝佸強鍏跺畠鐗屼骇鍝佹湁澶氬皯宸紓? 
[绛旓細martinhsu] NXP CFP15 offer the same performance with other vendors but higher quality performance.  [2014-7-17 10:46:31]
[闂細zhangjshl] 璇烽棶锛氱敱浜庝綋绉緢灏忥紝瀵筆CB甯冪嚎鏈変綍鐗规畩瑕佹眰锛 
[绛旓細martinhsu] As bigger as possible for the pad to get better thermal performance.  [2014-7-17 10:47:11]
[闂細hjb85] 鏄惁鏈夐拡瀵逛綆VF鍜屼綆IR杩涜浼樺寲锛 
[绛旓細martinhsu] Yes , the Vf and Ir is the most important parameters for schottky diode device.  [2014-7-17 10:47:55]
[闂細hjb85] 鏄惁鍙互鏀寔鍏夊鐒婄偣妫鏌ワ紵 
[绛旓細martinhsu] Yes !  [2014-7-17 10:48:32]
[闂細jackson2005] Vr50V鍙互鐢ㄥ湪澶氬皯V鐨凩PA?鍚屾牱鐨刅r45V涓轰綍? 
[绛旓細martinhsu] Normally it is used for 5v uotput adapter , 50v Vr could get more design margin.  [2014-7-17 10:49:23]
[闂細qditz] CFP15閮芥敮鎸佸摢浜涘钩鍙版垨鑰呭崗璁紝鍙互浜屾寮鍙戯紵 
[绛旓細martinhsu] The CPF15 is not only for LPA application but also for other application like the back drive protection...etc.  [2014-7-17 10:50:22]
[闂細tobn] 姝ｅ父宸ヤ綔鏈楂樻俯搴﹁寖鍥?璁捐涓渶瑕佽冭檻鏁ｇ儹闂? 
[绛旓細martinhsu] The maximum Tj is 150deC.Thermal is very important design point.  [2014-7-17 10:51:09]
[闂細jackson2005] NXP鏈"higherqualityperformance",鍙惁鍏蜂綋璇存槑?璋㈣阿! 
[绛旓細martinhsu] It is base on our fail return rate experience !!  [2014-7-17 10:52:05]
[闂細cntszxb] 姝ｅ悜鍘嬮檷鏈灏忓灏戯紵 
[绛旓細martinhsu] For PMEG45U10EPD , Vf=422mV(typ)@If=10A  [2014-7-17 11:20:10]
[闂細zendy] 鎶楀共鎵版庝箞澶勭悊 
[绛旓細martinhsu] It is related to the layout and Trr performance.  [2014-7-17 11:21:06]
[闂細jackson2005] Solderability涓庢暎鐑ц兘鍏崇郴闈炲父绱у瘑.璇烽棶瑕佸浣曟祴璇曞強妫鏌ョ‘璁? 
[绛旓細martinhsu] It is related to factory test criteria , it is normally use the X-inspection to check it.  [2014-7-17 11:23:05]
[闂細iwqtthf] CFP15 灏佽鑲栫壒鍩轰簩绱氱鐩稿浜庡叾浠栧櫒浠舵湁鍝簺鏂扮壒鎬? 
[绛旓細martinhsu] bigger thermal pad to achieve the better thermal performance  [2014-7-17 11:23:52]
[闂細jackson2005] 姝ｅ父NXP鐨刦ailreturnrate鏄灏?鐩告瘮鍏剁珵浜夊巶鍟嗘湁澶氬ぇ浼樺娍? 
[绛旓細martinhsu] Sorry , it is confideintial , I can not release the data.  [2014-7-17 11:24:32]
[闂細jackson2005] 鏈夋洿楂樼數鍘嬪強鏇撮珮鐢垫祦鐨勫紑鍙戣鍒? 
[绛旓細martinhsu] Yes , we will release higher voltage and current device in the future.  [2014-7-17 11:24:59]
[闂細qihongbj] 鏈夋暟鎹墜鍐屽悧锛 
[绛旓細martinhsu] Pls download the datasheet from NXP website. Thanks !  [2014-7-17 11:25:25]
[涓绘寔浜猴細ChinaECNet] 鍚勪綅缃戝弸锛岀敱浜庢椂闂寸殑鍏崇郴锛屼粖澶╃殑搴ц皥浼氬湪11:30缁撴潫锛岃澶у鎶撶揣鏃堕棿鎻愰棶銆  [2014-7-17 11:26:04]
[闂細jackson2005] 鏈夋棤鏍囧噯鐨凱CB甯冪嚎鎸囧鍙緵鍙傝? 
[绛旓細martinhsu] We just provide the footprint recommandation , the layout is really dependence on the design.  [2014-7-17 11:26:37]
[闂細tobn] 鑲栫壒鍩轰簩绾х浜у搧鐨勮鏍煎ぇ灏忓弬鏁版槸濡備綍鐨? 
[绛旓細martinhsu] The shottky diode key parameter are the Vf , Ir and Trr.  [2014-7-17 11:27:29]
[闂細cy301] 鏈夊摢浜涙柊鎶鏈柊搴旂敤 
[绛旓細martinhsu] The package is used the clip bonding technology to instead of the normnal wire bonding.  [2014-7-17 11:28:11]
[闂細lpgoal] 鏁ｇ儹闇瑕佸摢浜涚壒鍒鐞 
[绛旓細martinhsu] As bigger as possible for the pad to get better thermal performacne.  [2014-7-17 11:28:40]
[闂細hjb85] 鍦ㄧ粨鏋勫師鐞嗕笂涓嶱N缁撲簩鏋佺鏈変粈涔堝尯鍒紵 
[绛旓細martinhsu] The most difference is the Vf , so shottky designed more mobility for the electronic , electronic hole to achieve the low Vf performance.  [2014-7-17 11:31:27]
[涓绘寔浜猴細ChinaECNet] 鍚勪綅缃戝弸锛屼粖澶╃殑搴ц皥鍒拌繖閲屽氨缁撴潫浜嗭紝鎰熻阿澶у鍙備笌銆  [2014-7-17 11:35:33]
[ 鏈杩 10 鏉￠棶绛 ] [ 鍏ㄩ儴鍙戣█ ]
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